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Another Launch from Le Mark
The new RFID Carrier PAL Label to be launched at PLASA is a new two-part label manufacturing system that allows for RFID Tags to be fully encapsulated between Le Mark's well tested 480 micron rigid PVC and super strong Triple S adhesive.
Le Mark has managed to keep their existing low profile Label by utilizing the all new Penn Elcom Polycarbonate recessable flight case dish. The new polycarbonate dish is used instead of conventional steel and this resolves the problem caused by metal surfaces ‘blanking' the RFID signal. Le Mark has developed this new RFID Label in conjunction with Navigator Systems' ‘HireTag'.
For clients wishing to utilize their existing flight cases using the conventional recessed steel dish, then Le Mark can produce a PAL Label with a 6mm adhesive system. This will again provide the required 6 mm ‘gap' between the RFID tag and the steel dish.
Le Mark will be exhibiting their new RFID PAL Labels on stand D4 in Earls Court 1.
10th September 2009
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